wafer mount,wire bond

high-throughput multiple dies-to-wafer bonding technology and
wafer端子座-1.25mm间距-2p卧式贴片针座
8mm贴片连接器,接插件,wafer,插座,插针,底座
8寸wafer frame
ic 芯片封装流程ppt fol– wafer saw晶圆切割 wafer mount 晶圆安装